PCB laser processing services

Much of the printed circuit board (PCB) work done in the USA is quick turn around or prototype design work well suited to the laser’s flexibility and accuracy. This work is mainly a combination of IR and UV lasers.

A cross-section of plated Mircro-Via. Vias are typically .006″ diameter going through .002-.003″ thick dielectric. The top layer of copper can either be solid copper or pre-etched with the desired via diameter and locations.

Flex Circuit singulation or profiling. Accu-Tech’s laser systems allow optically aligning to existing patterns and laser routing/singulation of flex circuits.

Laser Skiving to expose Flying Leads beneath polyimides or coverlay materials.